Next-Generation ICs for Mobile Devices
Innovations in Wireless Design from ISSCC-2010

Product Type: Technology Analysis
Date: March 2010
Author: Michael Demler
28 pages
Price: $95

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Design innovations at the 2010 International Solid State Circuits Conference (ISSCC) provided a glimpse into the not-too-distant future for more powerful smartphones with higher performance mobile processors, high-definition video, 3D graphics and 4G broadband connectivity.

This report reviews the most significant of these advances in IC design from engineers at some of the leading semiconductor companies worldwide.

An analysis of each innovation assesses the impact they will have on future wireless consumer electronics. In most cases these designs are early prototypes, foretelling the advances that will be seen within the next two years.

Companies represented in this report:
    Advanced Circuit Pursuit
    Analog Devices
    ARM
    Broadcom
    Intel
    Marvell
    Nokia
    NXP Semiconductors
    Qualcomm
    Renesas
    Samsung
    ST-Ericsson
    Texas Instruments
    Toshiba